Toward a constitutive model for cure-dependent modulus of a high temperature epoxy during the cure
نویسندگان
چکیده
منابع مشابه
investigating the feasibility of a proposed model for geometric design of deployable arch structures
deployable scissor type structures are composed of the so-called scissor-like elements (sles), which are connected to each other at an intermediate point through a pivotal connection and allow them to be folded into a compact bundle for storage or transport. several sles are connected to each other in order to form units with regular polygonal plan views. the sides and radii of the polygons are...
Cure progress in epoxy systems: dependence on temperature and time
We have developed an analytical formula for the cure progress of epoxy systems as a function of both time t and temperature T. Complex viscosity h* or the storage modulus G' are used as the measures of the cure progress. The equation is based on the shape of the isothermal viscosity vs. time curves typically found for thermoset systems; temperature dependence of the isothermal parameters is est...
متن کاملToward a cure for chronic myeloid leukemia.
A diagnosis of chronic myeloid leukemia (CML) remains unwelcome news. Thanks to imatinib, however, the majority of newly diagnosed patients with chronic phase CML achieve a complete cytogenetic response (CCyR) and can expect longterm survival, often without major side effects (1). Unfortunately, these responses are not equivalent to a cure because residual leukemia cells persist even in patient...
متن کاملStriving Toward a Cure for Prostate Cancer.
Androgen receptor (AR) signaling is essential for cancer cell proliferation throughout much, if not all, of the course of a patient’s journey through prostate cancer. Discovery of the AR in the late 1960s prompted development of antiandrogen drugs that competitively inhibit binding of androgens to the AR ligandbinding domain (LBD), leading to conformational changes in AR that disrupt its functi...
متن کاملViscoelastic Properties of an Epoxy Resin during Cure
The cure dependent relaxation modulus of an epoxy resin was investigated over the entire range of cure extent. Parallel plate rheometry was used to measure the material behavior below the gel point of the epoxy network. Creep testing in three-point bend was used for specimens cured past gelation. All data were converted to the stress relaxation modulus for comparison of the material behavior am...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: European Polymer Journal
سال: 2010
ISSN: 0014-3057
DOI: 10.1016/j.eurpolymj.2010.06.002